anisotropic etching

1. What is anisotropic etching?
2. What is isotropic and anisotropic etching?
3. Is dry etching anisotropic?
4. What are the types of etching?
5. What is plasma etching used for?
6. What is silicon etching?
7. What is the difference between wet etching and dry etching?
8. What is the difference between isotropic and anisotropic?
9. What is the meaning of etching?
10. What can cause the etching event in dry etching?
11. Is wet etching isotropic?
12. Which are the type of dry etching?

What is anisotropic etching?

Anisotropic etching is a subtractive microfabrication technique that aims to preferentially remove a material in specific directions to obtain intricate and often flat shapes. Wet techniques exploit the crystalline properties of a structure to etch in directions governed by crystallographic orientation.

What is isotropic and anisotropic etching?

The differences between isotropic and anisotropic etching has to do with the shape that they carve out under the etching mask. Anisotropic etching is when the plasma etch is perpendicular and occurs in one direction whereas isotropic etching occurs when the plasma etch is in all directions.

Is dry etching anisotropic?

Dry etching is usually an anisotropic process in which the momentum of ion species accelerating towards the substrate in combination with a masking process is used to physically remove and etch the target materials.

What are the types of etching?

In general, there are two classes of etching processes:

• Wet etching where the material is dissolved when immersed in a chemical solution.
• Dry etching where the material is sputtered or dissolved using reactive ions or a vapor phase etchant.

What is plasma etching used for?

Plasma etching is used to 'roughen' a surface, on the microscopic scale. The surface of the component is usually etched with a reactive process gas which gives both a chemical and physical effect on the surface.

What is silicon etching?

INTRODUCTION. Etching, in the context of this book, refers to the dissolution processes that uniformly or preferentially remove material from silicon crystals immersed in a solution. Etching of silicon has been extensively explored due to its useful applications in the fabrica- tion of electronic devices.

What is the difference between wet etching and dry etching?

Dry and wet etching are two major types of etching processes. These processes are useful for the removal of surface materials and creation of patterns on the surfaces. The main difference between dry etching and wet etching is that dry etching is done at a liquid phase whereas wet etching is done at a plasma phase.

What is the difference between isotropic and anisotropic?

Isotropic refers to the properties of a material which is independent of the direction whereas anisotropic is direction-dependent. These two terms are used to explain the properties of the material in basic crystallography. ... Some examples of anisotropic materials are composite materials, wood, etc.

What is the meaning of etching?

transitive verb. 1a : to produce (something, such as a pattern or design) on a hard material by eating into the material's surface (as by acid or laser beam) b : to subject to such etching. 2 : to delineate or impress clearly scenes etched in our minds pain was etched on his features.

What can cause the etching event in dry etching?

Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that ...

Is wet etching isotropic?

Wet chemical etching is generally isotropic even though a mask is present since the liquid etchant can penetrate underneath the mask. Since directionality is usually important for high-resolution pattern transfer, wet chemical etching is normally not used.

Which are the type of dry etching?

There are three types of dry etching (e.g., plasma etching): chemical reactions (by using reactive plasma or gases), physical removal (generally by momentum transfer), and a combination of chemical reactions and physical removal.